Presents......

The 9600 series non-contact thickness measurement system uses patented Automatic Positioning Backpressure Probe (APBP) technology. Providing sub-micron accuracy and measurement on virtually ANY material type, the SigmaTech system is the new choice for thickness, bow & warp measurements on alternative substrates.

	9600A The SIGMATECH 9600A is an automatic non-contact thickness measurement system for semiconductor wafers and substrates. The 9600A combines a non-contact pneumatic sensor with a precision computer-controlled stage that is user programmable for specific measurement positions, and an autoloading robot to handle the wafers or substrates.
NOTE: Shown with covers removed to more clearly show mechanisms.

This is just a small sample of the products offered by SigmaTech.
Please contact your local TCG representative for more information.

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